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MT16VDDF6464HG-265 参数 Datasheet PDF下载

MT16VDDF6464HG-265图片预览
型号: MT16VDDF6464HG-265
PDF下载: 下载PDF文件 查看货源
内容描述: 小外形的DDR SDRAM DIMM [SMALL-OUTLINE DDR SDRAM DIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 31 页 / 552 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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512MB, 1GB (x64)  
200-PIN DDR SODIMM  
Table 16: DDR SDRAM Component Electrical Characteristics and Recommended AC  
Operating Conditions (-26A, -265, -202)  
Notes: 1–5, 12–15, 29, 40; notes appear on pages 20–23; 0°Cꢀ? TA ? +70°C; VDD = VDDQ = +2.5V 0.2V  
AC CHARACTERISTICS  
-26A  
-265  
-202  
PARAMETER  
SYMBOL MIN MAX MIN MAX MIN MAX UNITS NOTES  
tAC  
tCH  
tCL  
-0.75 +0.75 -0.75 +0.75 -0.8 +0.8  
ns  
Access window of DQs from CK/CK#  
CK high-level width  
CK low-level width  
Clock cycle time  
tCK  
tCK  
ns  
0.45  
0.45  
7.5  
0.55  
0.55  
13  
0.45  
0.45  
7.5  
0.55 0.45 0.55  
0.55 0.45 0.55  
26  
26  
tCK (2.5)  
tCK (2)  
tDH  
13  
13  
8
13  
13  
40, 46  
40, 46  
23, 27  
23, 27  
27  
CL=2.5  
CL=2  
7.5  
13  
10  
10  
0.6  
0.6  
2
ns  
ns  
ns  
ns  
ns  
DQ and DM input hold time relative to DQS  
DQ and DM input setup time relative to DQS  
DQ and DM input pulse width (for each input)  
Access window of DQS from CK/CK#  
DQS input high pulse width  
0.5  
0.5  
tDS  
0.5  
0.5  
tDIPW  
tDQSCK  
tDQSH  
tDQSL  
tDQSQ  
1.75  
1.75  
-0.75 +0.75 -0.75 +0.75 -0.8 +0.8  
tCK  
tCK  
0.35  
0.35  
0.35  
0.35  
0.35  
0.35  
DQS input low pulse width  
DQS-DQ skew, DQS to last DQ valid, per group,  
per access  
0.5  
0.5  
0.6  
ns  
22, 23  
tDQSS  
tDSS  
tDSH  
tHP  
tHZ  
tLZ  
tCK  
tCK  
tCK  
0.75  
0.20  
0.20  
1.25  
0.75  
0.20  
0.20  
1.25 0.75 1.25  
Write command to first DQS latching transition  
DQS falling edge to CK rising - setup time  
DQS falling edge from CK rising - hold time  
Half clock period  
0.20  
0.20  
tCH,tCL  
+0.75  
tCH,tCL  
+0.75  
tCH,tCL  
+0.8  
ns  
8
Data-out high-impedance window from CK/CK#  
Data-out low-impedance window from CK/CK#  
ns  
ns  
ns  
16, 37  
16, 38  
12  
-0.75  
0.90  
-0.75  
0.90  
-0.8  
tIHF  
1.1  
Address and control input hold time (fast slew  
rate)  
tISF  
tIHS  
tISS  
.900  
1
0.90  
1
1.1  
1.1  
1.1  
ns  
ns  
ns  
12  
12  
12  
Address and control input setup time (fast slew rate)  
Address and control input hold time (slow slew rate)  
1
1
Address and control input setup time (slow slew  
rate)  
tIPW  
2.2  
2.2  
2.2  
ns  
Address and Control input pulse width (for each  
input)  
tMRD  
tQH  
LOAD MODE REGISTER command cycle time  
15  
15  
16  
ns  
ns  
tHP -tQHS  
0.75  
tHP -tQHS  
0.75  
tHP -tQHS  
1
22, 23  
31  
DQ-DQS hold, DQS to first DQ to go non-valid,  
per access  
tQHS  
tRAS  
tRAP  
tRC  
Data hold skew factor  
ns  
40 120,000 40 120,000 40 120,000 ns  
ACTIVE to PRECHARGE command  
ACTIVE to READ with Auto precharge command  
20  
65  
20  
65  
20  
70  
ns  
ns  
ACTIVE to ACTIVE/AUTO REFRESH command  
period  
tRFC  
tRCD  
tRP  
75  
20  
20  
75  
20  
20  
80  
20  
20  
ns  
ns  
ns  
44  
AUTO REFRESH command period  
ACTIVE to READ or WRITE delay  
PRECHARGE command period  
09005aef80a646bc  
DDF16C64_128x64HG_B.fm - Rev. B 7/03 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology, Inc.  
18  
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