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MT16HTF6464AY 参数 Datasheet PDF下载

MT16HTF6464AY图片预览
型号: MT16HTF6464AY
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR2 SDRAM Unbuffered DIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 21 页 / 420 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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512MB, 1GB, 2GB: (x64, DR) 240-Pin DDR2 SDRAM UDIMM  
Electrical Specifications  
Electrical Specifications  
Stresses greater than those listed in Table 6 may cause permanent damage to the device.  
This is a stress rating only, and functional operation of the device at these or any other  
conditions above those indicated in the operational sections of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended periods may  
affect reliability.  
Table 6:  
Absolute Maximum Ratings  
Parameter  
Symbol  
Min  
Max  
Units  
VDD  
VDDQ  
VDDL2  
VIN, VOUT  
TSTG  
–1.0  
–0.5  
–0.5  
–0.5  
–55  
0
2.3  
2.3  
2.3  
2.3  
100  
85  
V
V
VDD supply voltage relative to VSS  
VDDQ supply voltage relative to VSS  
VDDL supply voltage relative to Vss  
Voltage on any pin relative to VSS  
Storage temperature  
V
V
°C  
°C  
°C  
Tcase  
DDR2 SDRAM device operating temperature (ambient)  
Operating temperature (ambient)  
TOPR  
0
55  
II  
Input leakage current; Any input 0V VIN VDD;  
VREF input 0V VIN 0.95V;  
(All other pins not under test = 0V)  
Command/address,  
RAS#, CAS#, WE#  
–80  
80  
S#, CKE1  
–40  
–20  
–30  
–10  
40  
20  
30  
10  
µA  
CK0, CK0#  
CK1, CK1#, CK2, CK2#  
DM  
IOZ  
Output leakage current; 0V VOUT VDDQ; DQ and DQ, DQS, DQS#  
ODT are disabled  
–10  
–32  
10  
32  
µA  
µA  
VREF leakage current; VREF = Valid VREF level  
Notes: 1. S# is defined to be S0# and S1#. CKE includes both CKE0 and CKE1.  
2. VDDL is the power supply for the DDR2 devices’ DLL; however, this power supply is not  
brought directy to a DIMM pin.  
Capacitance  
At DDR2 data rates, Micron encourages designers to simulate the performance of the  
module to achieve optimum values. When inductance and delay parameters associated  
with trace lengths are used in simulations, they are significantly more accurate and real-  
istic than a gross estimation of module capacitance. Simulations can then render a  
considerably more accurate result. JEDEC modules are now designed by using simula-  
tions to close timing budgets.  
PDF: 09005aef80f09084/Source: 09005aef80f09068  
HTF16C64_128_256x64AG.fm - Rev. D 5/06 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
8
©2003 Micron Technology, Inc. All rights reserved.  
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