TCM809/TCM810
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
E
E1
2
B
n
p
p1
D
1
α
c
A
A2
φ
β
L
A1
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
B
α
β
MIN
INCHES*
NOM
3
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
.006
.017
5
5
MAX
.035
.035
.000
.083
.047
.110
.014
0
.004
.015
0
0
.044
.040
.004
.104
.055
.120
.022
10
.007
.020
10
10
MILLIMETERS
MIN
NOM
3
0.96
1.92
0.89
1.01
0.88
0.95
0.01
0.06
2.10
2.37
1.20
1.30
2.80
2.92
0.35
0.45
0
5
0.09
0.14
0.37
0.44
0
5
0
5
MAX
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
0.18
0.51
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS21661C-page 8
2004 Microchip Technology Inc.
MICROCHIP [ MICROCHIP TECHNOLOGY ]
