1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
1.05
0.95
Pin # 1 Identifier
0.50
BSC
8.10
7.90
0.27
0.17
0.15
0.05
12.50
12.30
DETAIL
1.20
max.
0.70
0.50
14.20
13.80
0°- 5°
0.70
0.50
Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
32-tsop-WH-7
1mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
Figure 21:32-lead Thin Small Outline Package (TSOP) 8mm x 14mm
SST Package Code: WH
©2013 Silicon Storage Technology, Inc.
DS25022B
04/13
26
MICROCHIP [ MICROCHIP ]
