Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic
Package Outline
Figure 2 128-Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint.
Table 1 128-Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
D
D1
E
E1
H
L
L1
e
q
W
R1
R2
ccc
~
~
~
~
3.4
0.5
Overall Package Height
Standoff
0.05
2.55
23.00
19.90
17.00
13.90
0.09
0.73
~
3.05
23.40
20.10
17.40
14.10
0.20
1.03
~
Body Thickness
X Span
X body Size
Y Span
Y body Size
23.20
20.00
17.20
14.00
~
0.88
1.60
Lead Frame Thickness
Lead Foot Length
Lead Length
0.50 Basic
Lead Pitch
Lead Foot Angle
Lead Width
0o
0.10
0.08
0.08
~
~
~
~
~
~
7o
0.30
~
0.30
0.08
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Controlling Unit: millimeter.
3. Tolerance on the position of the leads is ± 0.04 mm maximum.
4. Package body dimensions D1 and E1 do not include the mold protrusion.
5. Maximum mold protrusion is 0.25 mm.
6. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
7. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC SCH5017
5
Revision 0.5 (05-24-07)
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