PIC18FXX20
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
c
n
°
CH x 45
A
α
A2
φ
β
L
A1
(F)
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
80
MAX
n
p
n1
A
A2
A1
L
(F)
φ
Number of Pins
Pitch
Pins per Side
Overall Height
80
.020
20
0.50
20
.039
.037
.002
.018
.043
.039
.004
.024
.039
3.5
.551
.551
.472
.472
.006
.009
.035
10
.047
1.00
0.95
0.05
0.45
1.10
1.00
0.10
0.60
1.00
3.5
14.00
14.00
12.00
12.00
0.15
0.22
0.89
10
1.20
Molded Package Thickness
Standoff
.041
.006
.030
1.05
0.15
0.75
§
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
0
.541
.541
.463
.463
.004
.007
.025
5
7
.561
.561
.482
.482
.008
.011
.045
15
0
13.75
13.75
11.75
11.75
0.09
0.17
0.64
5
7
14.25
14.25
12.25
12.25
0.20
0.27
1.14
15
E
D
E1
D1
c
B
CH
α
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
2003 Microchip Technology Inc.
Advance Information
DS39609A-page 345
MICROCHIP [ MICROCHIP ]
