PIC18FXX20
28.2 Package Details
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
°
CH x 45
α
A
c
A2
L
φ
β
A1
(F)
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
64
MAX
n
p
n1
A
A2
A1
L
(F)
φ
Number of Pins
Pitch
Pins per Side
Overall Height
64
.020
16
0.50
16
.039
.043
.039
.006
.024
.039
3.5
.472
.472
.394
.394
.007
.009
.035
10
.047
1.00
0.95
0.05
0.45
1.10
1.00
0.15
0.60
1.00
3.5
12.00
12.00
10.00
10.00
0.18
0.22
0.89
10
1.20
Molded Package Thickness
Standoff
.037
.002
.018
.041
.010
.030
1.05
0.25
0.75
§
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
0
.463
.463
.390
.390
.005
.007
.025
5
7
.482
.482
.398
.398
.009
.011
.045
15
0
11.75
11.75
9.90
9.90
0.13
0.17
0.64
5
7
12.25
12.25
10.10
10.10
0.23
0.27
1.14
15
E
D
E1
D1
c
B
CH
α
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
DS39609A-page 344
Advance Information
2003 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
