欢迎访问ic37.com |
会员登录 免费注册
发布采购

PIC16F722-I/SS 参数 Datasheet PDF下载

PIC16F722-I/SS图片预览
型号: PIC16F722-I/SS
PDF下载: 下载PDF文件 查看货源
内容描述: 28 /40/ 44引脚闪存单片机采用纳瓦XLP技术 [28/40/44-Pin Flash Microcontrollers with nanoWatt XLP Technology]
分类和应用: 闪存微控制器
文件页数/大小: 302 页 / 4540 K
品牌: MICROCHIP [ MICROCHIP ]
 浏览型号PIC16F722-I/SS的Datasheet PDF文件第191页浏览型号PIC16F722-I/SS的Datasheet PDF文件第192页浏览型号PIC16F722-I/SS的Datasheet PDF文件第193页浏览型号PIC16F722-I/SS的Datasheet PDF文件第194页浏览型号PIC16F722-I/SS的Datasheet PDF文件第196页浏览型号PIC16F722-I/SS的Datasheet PDF文件第197页浏览型号PIC16F722-I/SS的Datasheet PDF文件第198页浏览型号PIC16F722-I/SS的Datasheet PDF文件第199页  
PIC16F72X/PIC16LF72X  
The device is placed into Program/Verify mode by  
holding the ICSPCLK and ICSPDAT pins low then  
raising the voltage on MCLR/VPP from 0v to VPP. In  
Program/Verify mode the Program Memory, User IDs  
and the Configuration Words are programmed through  
20.0 IN-CIRCUIT SERIAL  
PROGRAMMING™ (ICSP™)  
ICSP™ programming allows customers to manufacture  
circuit boards with unprogrammed devices. Programming  
can be done after the assembly process allowing the  
device to be programmed with the most recent firmware  
or a custom firmware. Five pins are needed for ICSP™  
programming:  
serial communications. The ICSPDAT pin is  
a
bidirectional I/O used for transferring the serial data and  
the ISCPCLK pin is the clock input. For more information  
on ICSP™ refer to the “PIC16F72x/PIC16LF72x  
Programming Specification” (DS41332).  
• ICSPCLK  
• ICSPDAT  
• MCLR/VPP  
• VDD  
Note:  
The ICD 2 produces a VPP voltage greater  
than the maximum VPP specification of the  
PIC16F72X/PIC16LF72X. When using  
this programmer, an external circuit, such  
as the AC164112 MPLAB ICD 2 VPP volt-  
age limiter, is required to keep the VPP  
voltage within the device specifications.  
• VSS  
FIGURE 20-1:  
TYPICAL CONNECTION FOR ICSP™ PROGRAMMING  
External  
Programming  
Signals  
Device to be  
Programmed  
VDD  
VDD  
VDD  
10k  
VPP  
MCLR/VPP  
VSS  
GND  
Data  
ICSPDAT  
ICSPCLK  
Clock  
*
*
*
To Normal Connections  
Isolation devices (as required).  
*
© 2009 Microchip Technology Inc.  
DS41341E-page 195