PIC16F688
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
A1
L
β
Units
INCHES*
NOM
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
MIN
MAX
n
p
Number of Pins
Pitch
14
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
1.27
1.55
1.42
0.18
5.99
3.90
8.69
0.38
0.84
4
Overall Height
A
.053
.069
1.35
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.150
.337
.010
.016
0
.061
.010
.244
.157
.347
.020
.050
8
1.32
0.10
5.79
3.81
8.56
0.25
0.41
0
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.014
0
.009
.017
12
.010
.020
15
0.20
0.36
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
2004 Microchip Technology Inc.
Preliminary
DS41203B-page 161
MICROCHIP [ MICROCHIP ]
