PIC16F688
16.2 Package Details
The following sections give the technical details of the
packages.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
B1
β
eB
p
B
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
14
MAX
n
p
Number of Pins
Pitch
14
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
0.38
7.62
6.10
18.80
3.18
0.20
1.14
0.36
7.87
5
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
.145
3.68
.313
.250
.750
.130
.012
.058
.018
.370
10
.325
.260
.760
.135
.015
.070
.022
.430
15
7.94
6.35
19.05
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS41203B-page 160
Preliminary
2004 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
