PIC16F631/677/685/687/689/690
14.2.1
POWER-ON RESET (POR)
FIGURE 14-2:
RECOMMENDED MCLR
CIRCUIT
The on-chip POR circuit holds the chip in Reset until VDD
has reached a high enough level for proper operation. A
maximum rise time for VDD is required. See
Section 17.0 “Electrical Specifications” for details. If
the BOR is enabled, the maximum rise time specification
does not apply. The BOR circuitry will keep the device in
Reset until VDD reaches VBOR (see Section 14.2.4
“Brown-out Reset (BOR)”).
VDD
R1
PIC16F685
1 kΩ (or greater)
MCLR
Note:
The POR circuit does not produce an
internal Reset when VDD declines. To
re-enable the POR, VDD must reach Vss
for a minimum of 100 μs.
C1
0.1 μF
(optional, not critical)
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
14.2.3
POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates from the 31 kHz
LFINTOSC oscillator. For more information, see
Section 3.5 “Internal Clock Modes”. The chip is kept
in Reset as long as PWRT is active. The PWRT delay
allows the VDD to rise to an acceptable level. A
Configuration bit, PWRTE, can disable (if set) or enable
(if cleared or programmed) the Power-up Timer. The
Power-up Timer should be enabled when Brown-out
Reset is enabled, although it is not required.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
14.2.2
MCLR
PIC16F631/677/685/687/689/690 has a noise filter in
the MCLR Reset path. The filter will detect and ignore
small pulses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
The Power-up Timer delay will vary from chip-to-chip
and vary due to:
The behavior of the ESD protection on the MCLR pin
has been altered from early devices of this family.
Voltages applied to the pin that exceed its specification
can result in both MCLR Resets and excessive current
beyond the device specification during the ESD event.
For this reason, Microchip recommends that the MCLR
pin no longer be tied directly to VDD. The use of an RC
network, as shown in Figure 14-2, is suggested.
• VDD variation
• Temperature variation
• Process variation
See DC parameters for details (Section 17.0 “Electrical
Specifications”).
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word register. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the RA3/MCLR pin
becomes an external Reset input. In this mode, the
RA3/MCLR pin has a weak pull-up to VDD.
© 2007 Microchip Technology Inc.
DS41262D-page 197