PIC16F631/677/685/687/689/690
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED
PAD
e
E2
E
2
1
b
2
1
K
N
N
NOTE 1
L
BOTTOM VIEW
TOP VIEW
A
A1
A3
Units
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
Number of Pins
N
e
20
Pitch
0.50 BSC
0.90
Overall Height
Standoff
A
0.80
0.00
1.00
0.05
A1
A3
E
0.02
Contact Thickness
Overall Width
0.20 REF
4.00 BSC
2.70
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
E2
D
2.60
2.80
4.00 BSC
2.70
D2
b
2.60
0.18
0.30
0.20
2.80
0.30
0.50
–
0.25
L
0.40
K
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-126B
© 2007 Microchip Technology Inc.
DS41262D-page 279
MICROCHIP [ MICROCHIP ]
