PIC16F631/677/685/687/689/690
19.2 Package Details
The following sections give the technical details of the packages.
20-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
E1
NOTE 1
1
2
3
D
E
A2
A
L
c
A1
b1
eB
e
b
Units
INCHES
NOM
20
Dimension Limits
MIN
MAX
Number of Pins
Pitch
N
e
.100 BSC
–
Top to Seating Plane
A
–
.210
.195
–
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.980
.115
.008
.045
.014
–
.130
–
.310
.250
1.030
.130
.010
.060
.018
–
.325
.280
1.060
.150
.015
.070
.022
.430
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing §
eB
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-019B
DS41262D-page 276
© 2007 Microchip Technology Inc.