PIC16F5X
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
1 2 3
NOTE 2
α
A
c
φ
A2
β
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
44
MAX
Number of Leads
Lead Pitch
N
e
0.80 BSC
–
Overall Height
A
–
1.20
1.05
0.15
0.75
Molded Package Thickness
Standoff
A2
A1
L
0.95
0.05
0.45
1.00
–
Foot Length
0.60
Footprint
L1
φ
1.00 REF
3.5°
Foot Angle
0°
7°
Overall Width
E
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
–
Overall Length
D
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
E1
D1
c
0.09
0.30
11°
0.20
0.45
13°
b
0.37
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
12°
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-076B
© 2007 Microchip Technology Inc.
DS41213D-page 79
MICROCHIP [ MICROCHIP ]
