PIC16F5X
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1 2 3
D
E
A2
A
L
c
b1
b
A1
e
eB
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
40
.100 BSC
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A
–
–
–
–
–
–
–
–
–
–
–
–
.250
.195
–
A2
A1
E
.125
.015
.590
.485
1.980
.115
.008
.030
.014
–
.625
.580
2.095
.200
.015
.070
.023
.700
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing §
eB
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-016B
DS41213D-page 78
© 2007 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
