PIC16F7X7
18.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR and RA4) .......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ............................................................................................................ -0.3 to +6.5V
Voltage on MCLR with respect to VSS (Note 2) ..............................................................................................0 to +13.5V
Voltage on RA4 with respect to VSS...................................................................................................................0 to +12V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA, PORTB and PORTE (combined) (Note 3)....................................................200 mA
Maximum current sourced by PORTA, PORTB and PORTE (combined) (Note 3)...............................................200 mA
Maximum current sunk by PORTC and PORTD (combined) (Note 3) .................................................................200 mA
Maximum current sourced by PORTC and PORTD (combined) (Note 3) ............................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)
2: Voltage spikes at the MCLR pin may cause latch-up. A series resistor of greater than 1 kΩ should be used
to pull MCLR to VDD, rather than tying the pin directly to VDD.
3: PORTD and PORTE are not implemented on the PIC16F737/767 devices.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2004 Microchip Technology Inc.
DS30498C-page 207
MICROCHIP [ MICROCHIP ]
