PIC16F7X7
20.2 Package Details
The following sections give the technical details of the
packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
B1
β
A1
eB
B
p
Units
INCHES*
NOM
28
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
28
MAX
n
p
Number of Pins
Pitch
.100
2.54
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A
A2
A1
E
.140
.150
.130
.160
3.56
3.81
3.30
4.06
.125
.015
.300
.275
1.345
.125
.008
.040
.016
.320
.135
3.18
0.38
7.62
6.99
34.16
3.18
0.20
1.02
0.41
8.13
5
3.43
.310
.285
1.365
.130
.012
.053
.019
.350
10
.325
.295
1.385
.135
.015
.065
.022
.430
15
7.87
7.24
34.67
3.30
0.29
1.33
0.48
8.89
10
8.26
7.49
35.18
3.43
0.38
1.65
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
5
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
2004 Microchip Technology Inc.
DS30498C-page 253
MICROCHIP [ MICROCHIP ]
