PIC16F62X
17.2
DC CHARACTERISTICS:
PIC16LF62X-04 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature –40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ TA ≤ +70°C for commercial and
–40°C ≤ TA ≤ +125°C for extended
Operating voltage VDD range as described in DC spec Table 17.1 and Table 12-2
Param Sym
No.
Characteristic Min Typ† Max Units Conditions
D001
D002
VDD
VDR
Supply Voltage
2.0
-
5.5
V
RAM Data Retention
Voltage (Note 1)
–
1.5*
–
V
Device in SLEEP mode
D003
D004
VPOR
SVDD
VDD start voltage to
ensure Power-on Reset
–
VSS
–
–
V
See section on Power-on Reset for
details
VDD rise rate to ensure
Power-on Reset
0.05*
–
V/ms See section on Power-on Reset for
details
D005
D010
VBOD
IDD
Brown-out Detect Voltage
Supply Current (Note 2, 5)
3.7
–
4.0
–
4.3
0.6
V
BODEN configuration bit is cleared
mA FOSC = 4.0 MHZ, VDD = 2.5
D013
–
–
–
4.0
–
–
7.0
6.0
2.0
mA FOSC = 20.0 MHz, VDD = 5.5
mA FOSC = 20.0 MHz, VDD = 4.5
mA FOSC = 10.0 MHz, VDD = 3.0
D020
IPD
Power Down Current (Note 2)
–
–
–
–
–
–
–
–
2.0
2.2
5.0
9.0
15.0
µA
µA
µA
µA
µA
VDD = 2.5
VDD = 3.0
VDD = 4.5
VDD = 5.5
VDD = 5.5 Extended
∆IWDT
∆IBOD
∆ICOMP
WDT Current (Note 4)
–
–
6.0
75
15
125
µA
µA
VDD=3.0V
BOD enabled, VDD = 5.0V
D023
1A
Brown-out Detect Current (Note 4)
Comparator Current for each
Comparator (Note 4)
–
–
30
50
135
µA
µA
VDD = 3.0V
VDD = 3.0V
∆IVREF
FOSC
VREF Current (Note 4)
LP Oscillator Operating Frequency
INTRC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
–
0
0
–
–
–
–
200
4
4
KHz All temperatures
MHz All temperatures
MHz All temperatures
MHz All temperatures
20
*
These parameters are characterized but not tested.
†
Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consump-
tion.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD to VSS.
4: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base
IDD or IPD measurement.
5: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the for-
mula Ir = VDD/2Rext (mA) with Rext in kΩ.
1999 Microchip Technology Inc.
Preliminary
DS40300B-page 135
MICROCHIP [ MICROCHIP ]
