PIC16C5X
PIC16C58A
16.4
DC Characteristics: PIC16LV58A-02 (Commercial)
PIC16LV58A-02 (Industrial)
Standard Operating Conditions (unless otherwise specified)
DC Characteristics
Power Supply Pins
Operating Temperature
0°C ≤ TA ≤ +70°C (commercial)
–20°C ≤ TA ≤ +85°C (industrial)
(1)
Characteristic
Sym Min Typ
Max Units Conditions
Supply Voltage
VDD
XT, RC and LP options
2.0
—
3.8
—
V
V
V
(2)
RAM Data Retention Voltage
VDR
—
—
1.5*
VSS
Device in SLEEP mode
See section on Power-On Reset for details
VDD start voltage to ensure
Power-On Reset
VPOR
—
VDD rise rate to ensure
Power-On Reset
SVDD
IDD
0.05*
—
—
V/ms See section on Power-On Reset for details
(3)
Supply Current
(4)
XT and RC options
—
—
—
0.5
11
14
1.8 mA FOSC = 2.0 MHz, VDD = 3.0V
27
35
LP option, Commercial
LP option, Industrial
µA FOSC = 32 kHz, VDD = 2.5V, WDT disabled
µA FOSC = 32 kHz, VDD = 2.5V, WDT disabled
(5)(6)
Power Down Current
IPD
Commercial
—
—
—
—
2.5
12
µA VDD = 2.5V, WDT enabled
µA VDD = 2.5V, WDT disabled
µA VDD = 2.5V, WDT enabled
µA VDD = 2.5V, WDT disabled
0.25 4.0
2.5 14
0.25 5.0
Industrial
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C.This data is for design guidance
only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kΩ.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
6: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection, if the SLEEP
mode is entered or during initial power-up.
DS30453B-page 136
Preliminary
1998 Microchip Technology Inc.