PIC16F7X
15.1 DC Characteristics: PIC16F73/74/76/77 (Industrial, Extended)
PIC16LF73/74/76/77 (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC16LF73/74/76/77
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
PIC16F73/74/76/77
(Industrial, Extended)
Param
Sym
No.
Characteristic
Min Typ† Max Units
Conditions
IDD
Supply Current (Notes 2, 5)
D010
PIC16LF7X
—
—
0.4 2.0
mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
µA LP osc configuration
D010A
20
48
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D010
D013
PIC16F7X
-
0.9
5.2
4
mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
mA HS osc configuration
—
15
FOSC = 20 MHz, VDD = 5.5V
D015* ∆IBOR Brown-out
Reset Current (Note 6)
Power-down Current (Notes 3, 5)
—
25 200
µA BOR enabled, VDD = 5.0V
D020
IPD
PIC16LF7X
—
—
2.0
0.1
30
5
µA VDD = 3.0V, WDT enabled, -40°C to +85°C
µA VDD = 3.0V, WDT disabled, -40°C to +85°C
D021
D020
D021
D021A
PIC16F7X
—
—
—
—
5.0
0.1
10.5 57
1.5 42
25 200
42
19
µA VDD = 4.0V, WDT enabled, -40°C to +85°C
µA VDD = 4.0V, WDT disabled, -40°C to +85°C
µA VDD = 4.0V, WDT enabled, -40°C to +125°C
µA VDD = 4.0V, WDT disabled, -40°C to +125°C
D023* ∆IBOR Brown-out
Reset Current (Note 6)
Legend: Shading of rows is to assist in readability of of the table.
—
µA BOR enabled, VDD = 5.0V
*
These parameters are characterized but not tested.
†
Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from-rail to-rail; all I/O pins tri-stated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
DS30325B-page 122
2002 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
