PIC16F87XA
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) — Packaging
EXPOSED
METAL
E
E1
PADS
Q
D1
D
D2
p
2
1
B
n
R
E2
BOTTOM VIEW
CH x 45
L
TOP VIEW
α
A2
A
A1
A3
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
NOM
MIN
MAX
MIN
MAX
n
Number of Pins
Pitch
28
28
p
.026 BSC
.033
0.65 BSC
0.85
Overall Height
A
A2
A1
A3
E
.039
1.00
Molded Package Thickness
Standoff
.026
.031
.002
0.65
0.80
0.05
.000
.140
.0004
0.00
0.01
0.20 REF.
Base Thickness
Overall Width
.008 REF.
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Molded Package Width
Exposed Pad Width
Overall Length
E1
E2
D
.146
.152
3.55
3.70
3.85
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Molded Package Length
Exposed Pad Length
Lead Width
D1
D2
B
.140
.009
.020
.005
.012
.009
.146
.152
.014
.030
.010
.026
.024
12
3.55
0.23
0.50
0.13
0.30
0.24
3.70
3.85
0.35
0.75
0.23
0.65
0.60
12
.011
.024
.007
.016
.017
0.28
0.60
0.17
0.40
0.42
Lead Length
L
Tie Bar Width
R
Tie Bar Length
Q
Chamfer
CH
α
Mold Draft Angle Top
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
2001 Microchip Technology Inc.
Advance Information
DS39582A-page 205
MICROCHIP [ MICROCHIP ]
