PIC16F87XA
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
E
E1
#leads=n1
D
D1
n 1 2
CH2 x 45°
CH1 x 45°
α
A3
A2
A
35°
B1
B
c
A1
β
p
E2
D2
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
44
44
.050
11
1.27
11
Pins per Side
Overall Height
n1
A
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
0
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.011
.029
.020
5
.180
4.19
3.68
0.51
0.61
1.02
0.00
17.40
17.40
16.51
16.51
14.99
14.99
0.20
0.66
0.33
0
4.39
3.87
0.71
0.74
1.14
0.13
17.53
17.53
16.59
16.59
15.75
15.75
0.27
0.74
0.51
5
4.57
Molded Package Thickness
Standoff
A2
A1
A3
CH1
CH2
E
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
4.06
0.89
0.86
1.27
0.25
17.65
17.65
16.66
16.66
16.00
16.00
0.33
0.81
0.53
10
§
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
D
Molded Package Width
Molded Package Length
Footprint Width
E1
D1
E2
D2
c
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B1
B
α
β
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
2001 Microchip Technology Inc.
Advance Information
DS39582A-page 201