PIC10F200/202/204/206
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
N
L
D
N
b
K
E
E2
EXPOSED PAD
NOTE 1
1
2
D2
TOP VIEW
BOTTOM VIEW
2
1
NOTE 1
A
A3
A1
NOTE 2
Units
Dimension Limits
MIN
MILLIMETERS
NOM
8
0.50 BSC
0.80
0.00
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
1.30
1.50
0.18
0.30
0.20
–
–
0.25
0.40
–
1.75
1.90
0.30
0.50
–
1.00
0.05
MAX
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
e
A
A1
A3
D
E
D2
E2
b
L
K
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
©
2007 Microchip Technology Inc.
DS41239D-page 85
MICROCHIP [ MICROCHIP TECHNOLOGY ]
