PIC10F200/202/204/206
6-Lead Plastic Small Outline Transistor (OT) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
4
E
E1
PIN 1 ID BY
LASER MARK
1
2
e
e1
D
3
A
A2
c
φ
A1
L
L1
Units
Dimension Limits
MIN
MILLIMETERS
NOM
6
0.95 BSC
1.90 BSC
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0°
0.08
–
–
–
–
–
–
–
–
–
–
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30°
0.26
MAX
Number of Pins
Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
N
e
e1
A
A2
A1
E
E1
D
L
L1
φ
c
Lead Width
b
0.20
–
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-028B
©
2007 Microchip Technology Inc.
DS41239D-page 83
MICROCHIP [ MICROCHIP TECHNOLOGY ]
