MCP73861/2/3/4
16-Lead Plastic Small Outline (SL) – Narrow 150 mil Body (SOIC)
E
E1
p
D
2
B
n
1
α
h
45°
c
A2
A
φ
L
A1
β
Units
INCHES*
NOM
16
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
16
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.053
.061
.057
.007
.237
.154
.390
.015
.033
4
.069
1.35
1.55
1.44
0.18
6.02
3.90
9.91
0.38
0.84
4
1.75
1.55
0.25
6.20
3.99
10.01
0.51
1.27
8
Molded Package Thickness
A2
A1
E
.052
.004
.228
.150
.386
.010
.016
0
.061
.010
.244
.157
.394
.020
.050
8
1.32
0.10
5.79
3.81
9.80
0.25
0.41
0
Standoff
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
0
12
15
0
12
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
DS21893C-page 22
© 2005 Microchip Technology Inc.