MCP73861/2/3/4
16-Lead Plastic Quad Flat No-Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated
D
D2
EXPOSED
METAL
PAD
(NOTE 2)
e
b
E2
E
2
1
n
OPTIONAL
L
TOP VIEW
BOTTOM VIEW
INDEX
AREA
(NOTE 1)
A3
A
A1
Units
Dimension Limits
INCHES
NOM
MILLIMETERS
*
MIN
MAX
MIN
NOM
MAX
n
e
Number of Pins
Pitch
16
16
.026 BSC
.035
.001
.008 REF
0.65 BSC
0.90
0.02
0.20 REF
Overall Height
Standoff
A
A1
A3
E
.031
.039
0.80
1.00
.000
.002
0.00
0.05
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
.152
.090
.152
.090
.010
.012
.157
.104
.157
.104
.012
.016
.163
.106
.163
.106
.014
.020
3.85
2.29
3.85
2.29
0.25
0.30
4.00
2.64
4.00
2.64
0.30
0.40
4.15
2.69
4.15
2.69
0.35
0.50
E2
D
D2
b
L
*
Controlling Parameter
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: M0-220
Drawing No. C04-127
Revised 07-21-05
© 2005 Microchip Technology Inc.
DS21893C-page 21
MICROCHIP [ MICROCHIP ]
