MCP6541/1R/1U/2/3/4
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
B
p1
D
n
1
α
c
A
A2
φ
L
A1
β
Units
INCHES
NOM
*
MILLIMETERS
NOM
5
Dimension Limits
MIN
MAX
MIN
MAX
n
p
Number of Pins
Pitch
5
.038
0.95
p1
A
Outside lead pitch (basic)
Overall Height
.075
.046
.043
.003
.110
.064
.116
.018
1.90
.035
.057
0.90
1.18
1.45
1.30
0.15
3.00
1.75
3.10
0.55
Molded Package Thickness
Standoff
A2
A1
E
.035
.000
.102
.059
.110
.014
.051
.006
.118
.069
.122
.022
10
0.90
0.00
2.60
1.50
2.80
0.35
1.10
0.08
Overall Width
2.80
Molded Package Width
Overall Length
E1
D
1.63
2.95
Foot Length
L
f
0.45
Foot Angle
0
5
0
5
10
c
Lead Thickness
Lead Width
.004
.014
.006
.017
.008
.020
10
0.09
0.35
0.15
0.43
0.20
0.50
B
a
Mold Draft Angle Top
Mold Draft Angle Bottom
0
0
5
5
0
5
5
10
10
b
10
0
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
EIAJ Equivalent: SC-74A
Revised 09-12-05
Drawing No. C04-091
DS21696E-page 22
© 2006 Microchip Technology Inc.