MCP6541/1R/1U/2/3/4
5-Lead Plastic Small Outline Transistor (LT) (SC-70)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
D
p
B
n
1
Q1
A2
A
c
A1
L
Units
INCHES
NOM
MILLIMETERS
NOM
*
Dimension Limits
MIN
MAX
MIN
MAX
n
p
Number of Pins
Pitch
5
5
.026 (BSC)
0.65 (BSC)
Overall Height
A
A2
A1
E
.031
.043
0.80
1.10
Molded Package Thickness
Standoff
.031
.000
.071
.045
.071
.004
.039
.004
.094
.053
.087
.012
0.80
0.00
1.80
1.15
1.80
0.10
1.00
0.10
2.40
1.35
2.20
0.30
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
Top of Molded Pkg to
Lead Shoulder
Q1
.004
.016
0.10
0.40
c
Lead Thickness
Lead Width
.004
.006
.007
.012
0.10
0.15
0.18
0.30
B
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (EIAJ) Standard: SC-70
Revised 07-19-05
Drawing No. C04-061
© 2006 Microchip Technology Inc.
DS21696E-page 21
MICROCHIP [ MICROCHIP ]
