MCP6141/2/3/4
6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
E
E1
B
p1
D
n
1
α
c
A
φ
A2
A1
β
L
Units
INCHES
*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
6
6
.038 BSC
.075 BSC
0.95 BSC
1.90 BSC
p1
Outside lead pitch
Overall Height
A
A2
A1
E
.035
.035
.000
.102
.059
.110
.014
.046
.043
.003
.110
.064
.116
.018
.057
0.90
1.18
1.45
Molded Package Thickness
Standoff
.051
.006
.118
.069
.122
.022
10
0.90
0.00
2.60
1.50
2.80
0.35
1.10
0.08
2.80
1.63
2.95
0.45
1.30
0.15
3.00
1.75
3.10
0.55
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
φ
Foot Angle
0
5
0
5
10
c
Lead Thickness
Lead Width
.004
.014
.006
.017
.008
.020
10
0.09
0.35
0.15
0.43
0.20
0.50
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
0
5
5
0
5
5
10
10
10
0
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
Revised 09-12-05
© 2005 Microchip Technology Inc.
DS21668B-page 21
MICROCHIP [ MICROCHIP ]
