MCP23018/MCP23S18
Package Types:
MCP23S18
PDIP/SOIC
QFN *
VSS
NC
1
2
3
4
5
6
7
8
9
28 NC
27 GPA7
26 GPA6
25 GPA5
24 GPA4
23 GPA3
22 GPA2
21 GPA1
20 GPA0
19 INTA
18 INTB
17 NC
GPB0
GPB1
GPB2
GPB3
GPB4
GPB5
GPB6
GPB7 10
VDD
CS
GPB1 1
GPB2 2
GPB3 3
GPB4 4
GPB5 5
GPB6 6
18 GPA3
17 GPA2
16 GPA1
15 GPA0
14 INTA *
13 RESET
EP
25
11
12
SCK 13
SI 14
16 RESET
15 SO
* INTB is not bonded out. Can be controlled in
IOCON.MIRROR
© 2008 Microchip Technology Inc.
DS22103A-page 3