MCP201
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
L
D1
b
N
N
K
E
E2
E1
EXPOSED
PAD
NOTE 1
1
2
2
1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
φ
A2
A
A3
A1
NOTE 2
Units
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
0.85
Overall Height
A
–
–
1.00
0.80
0.05
Molded Package Thickness
Standoff
A2
A1
A3
D
0.65
0.00
0.01
Base Thickness
0.20 REF
4.92 BSC
4.67 BSC
4.00
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
D1
D2
E
3.85
4.15
5.99 BSC
5.74 BSC
2.31
Molded Package Width
Exposed Pad Width
Contact Width
E1
E2
b
2.16
0.35
0.50
0.20
–
2.46
0.47
0.75
–
0.40
Contact Length
L
0.60
Contact-to-Exposed Pad
Model Draft Angle Top
K
–
φ
–
12°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-113B
DS21730F-page 32
© 2007 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
