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MCP1727-1202E/SN 参数 Datasheet PDF下载

MCP1727-1202E/SN图片预览
型号: MCP1727-1202E/SN
PDF下载: 下载PDF文件 查看货源
内容描述: 1.5A ,低电压,低静态电流LDO稳压器 [1.5A, Low Voltage, Low Quiescent Current LDO Regulator]
分类和应用: 线性稳压器IC调节器电源电路光电二极管输出元件
文件页数/大小: 32 页 / 787 K
品牌: MICROCHIP [ MICROCHIP ]
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MCP1727  
† Notice: Stresses above those listed under “Maximum Rat-  
ings” may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at  
those or any other conditions above those indicated in the  
operational listings of this specification is not implied. Expo-  
sure to maximum rating conditions for extended periods may  
affect device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings †  
VIN....................................................................................6.5V  
Maximum Voltage on Any Pin .. (GND – 0.3V) to (VDD + 0.3)V  
Maximum Power Dissipation......... Internally-Limited (Note 6)  
Output Short Circuit Duration................................Continuous  
Storage temperature .....................................-65°C to +150°C  
Maximum Junction Temperature, TJ ...........................+150°C  
ESD protection on all pins (HBM/MM) ........... ≥ 2 kV; 200V  
AC/DC CHARACTERISTICS  
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX) (Note 1), VR=1.8V for Adjustable Output,  
OUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.  
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C  
I
Parameters  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
Input Operating Voltage  
Input Quiescent Current  
VIN  
Iq  
2.3  
6.0  
V
Note 1  
IL = 0 mA, VIN = Note 1,  
OUT = 0.8V to 5.0V  
120  
0.1  
220  
µA  
V
Input Quiescent Current for  
SHDN Mode  
ISHDN  
IOUT  
1.5  
3
µA  
A
SHDN = GND  
Maximum Output Current  
VIN = 2.3V to 6.0V  
V
R = 0.8V to 5.0V, Note 1  
Line Regulation  
ΔVOUT  
(VOUT x ΔVIN  
/
0.05  
±0.5  
2.2  
0.16  
1.0  
%/V  
%
(Note 1) VIN 6V  
)
Load Regulation  
ΔVOUT/VOUT  
-1.0  
IOUT = 1 mA to 1.5A,  
V
IN = Note 1, (Note 4)  
Output Short Circuit Current  
IOUT_SC  
A
VIN = Note 1, RLOAD < 0.1Ω,  
Peak Current  
Adjust Pin Characteristics (Adjustable Output Only)  
Adjust Pin Reference Voltage  
VADJ  
0.402  
0.410  
0.418  
V
VIN = 2.3V to VIN = 6.0V,  
I
OUT = 1 mA  
Adjust Pin Leakage Current  
IADJ  
-10  
±0.01  
40  
+10  
nA  
VIN = 6.0V, VADJ = 0V to 6V  
Adjust Temperature Coefficient  
TCVOUT  
ppm/°C Note 3  
Fixed-Output Characteristics (Fixed Output Only)  
Voltage Regulation VOUT  
VR - 2.5%  
VR  
VR + 2.5%  
V
Note 2  
±0.5%  
Note 1: The minimum VIN must meet two conditions: VIN 2.3V and VIN VOUT(MAX) + VDROPOUT(MAX).  
2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output  
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.  
3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the  
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.  
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is  
tested over a load range from 1 mA to the maximum specified output current.  
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its  
nominal value that was measured with an input voltage of VOUT = VR + VDROPOUT(MAX)  
.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction  
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power  
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained  
junction temperatures above 150°C can impact device reliability.  
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the  
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the  
ambient temperature is not significant.  
© 2007 Microchip Technology Inc.  
DS21999B-page 5