ENC28J60
16.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature under bias.............................................................................................-40°C to +85°C (Industrial)
0°C to +70°C (Commercial)
Voltage on VDD, VDDOSC, VDDPLL, VDDRX, and VDDTX, with respect to VSS................................................ -0.3V to 3.6V
Voltage on RESET, CS, SCK and SI, with respect to VSS ........................................................................... -0.3V to 6.0V
Voltage on CLKOUT, SO, OSC1, OSC2, LEDA and LEDB, with respect to VSS...............................-0.3V to VDD + 0.3V
Voltage on TPIN+/- and TPOUT+/- with respect to VSS............................................................................... -0.3V to 5.0V
VCAP with respect to VSS (Note 1)............................................................................................................. -0.3V to 2.75V
ESD protection on all pins..........................................................................................................................................2 kV
Current sourced or sunk by LEDA, LEDB...............................................................................................................12 mA
Current sourced or sunk by CLKOUT.......................................................................................................................8 mA
Current sourced or sunk by INT and SO...................................................................................................................4 mA
Note 1: VCAP is not designed to supply an external load. No external voltage should be applied to this pin.
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
© 2006 Microchip Technology Inc.
Preliminary
DS39662B-page 79
MICROCHIP [ MICROCHIP ]
