AT25128B/AT25256B
Packaging Information
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
Overall Height
Molded Package Thickness
Standoff
Overall Width
A
-
-
-
-
1.75
-
0.25
A2
A1
E
1.25
0.10
§
6.00 BSC
Molded Package Width
Overall Length
E1
D
3.90 BSC
4.90 BSC
Chamfer (Optional)
Foot Length
h
L
0.25
0.40
-
-
0.50
1.27
Footprint
L1
1.04 REF
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
0°
0.17
0.31
5°
-
-
-
-
-
8°
c
0.25
0.51
15°
b
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev E Sheet 2 of 2
DS20006193A-page 29
© 2019 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
