5TS1 – SOT23
e1
C
4
5
E1
E
C
L
L1
3
1
2
TOP VIEW
END VIEW
b
A2
A
SEATING
PLANE
A1
e
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SIDE VIEW
MIN
-
0.00
MAX
1.10
0.10
NOM
NOTE
SYMBOL
A
A1
A2
c
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
-
-
0.70 0.90 1.00
0.08
-
0.20 3
D
E
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
1,2
1,2
1,2
E1
L1
e
e1
b
This drawing is for general information only. Refer to
JEDEC Drawing MO-193, Variation AB for additional
information.
0.30
-
0.50 3,4
11/5/08
GPC
DRAWING NO.
TITLE
REV.
5TS1, 5-lead, 1.60 mm Body, Plastic Thin
Package Drawing Contact:
packagedrawings@atmel.com
TSZ
5TS1
B
Shrink Small Outline Package (Shrink SOT)
24
AT24C02C [Preliminary]
8700C–SEEPR–6/10
MICROCHIP [ MICROCHIP ]
