AT24C02C [Preliminary]
8Y6 - UDFN
A
D2
b
(8X)
Pin 1
Indeex
Areeaa
Pin 1 ID
L (8X)
D
e (6X)
A2
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
2.00 BSC
3.00 BSC
1.50
NOTE
SYMBOL
D
E
D2
E2
A
1.40
1.60
1.40
0.60
0.05
0.55
-
-
-
-
A1
A2
A3
L
0.0
-
0.02
-
0.20 REF
0.30
0.20
0.20
0.40
0.30
e
0.50 BSC
0.25
b
2
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
11/21/08
GPC
DRAWING NO.
TITLE
REV.
8Y6, 8-lead 2.0x3.0 mm Body, 0.50 mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
Package Drawing Contact:
packagedrawings@atmel.com
YNZ
8Y6
E
23
8700C–SEEPR–6/10
MICROCHIP [ MICROCHIP ]
