欢迎访问ic37.com |
会员登录 免费注册
发布采购

W3H32M72E-533BI 参数 Datasheet PDF下载

W3H32M72E-533BI图片预览
型号: W3H32M72E-533BI
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX72, 0.65ns, CMOS, PBGA208, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 23 页 / 729 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
 浏览型号W3H32M72E-533BI的Datasheet PDF文件第1页浏览型号W3H32M72E-533BI的Datasheet PDF文件第2页浏览型号W3H32M72E-533BI的Datasheet PDF文件第3页浏览型号W3H32M72E-533BI的Datasheet PDF文件第4页浏览型号W3H32M72E-533BI的Datasheet PDF文件第6页浏览型号W3H32M72E-533BI的Datasheet PDF文件第7页浏览型号W3H32M72E-533BI的Datasheet PDF文件第8页浏览型号W3H32M72E-533BI的Datasheet PDF文件第9页  
W3H32M72E-XBX / W3H32M72E-XBXF  
DESCRIPTION  
GENERAL NOTES  
The 2Gb DDR2 SDRAM is a high-speed CMOS, dynamic random-  
access memory containing 2,147,483,648 bits. Each of the four  
chips in the MCP are internally congured as 8-bank DRAM. The  
block diagram of the device is shown in Figure 2. Ball assignments  
and are shown in Figure 3.  
The functionality and the timing specications discussed in this  
data sheet are for the DLL-enabled mode of operation.  
Throughout the data sheet, the various gures and text refer to  
DQs as “DQ.” The DQ term is to be interpreted as any and all DQ  
collectively, unless specically stated otherwise.Additionally, each  
chip is divided into 2 bytes, the lower byte and upper byte. For  
the lower byte (DQ0–DQ7), DM refers to LDM and DQS refers to  
LDQS. For the upper byte (DQ8–DQ15), DM refers to UDM and  
DQS refers to UDQS.  
The 2Gb DDR2 SDRAM uses a double-data-rate architecture to  
achieve high-speed operation. The double data rate architecture is  
essentially a 4n-prefetch architecture, with an interface designed  
to transfer two data words per clock cycle at the I/O balls. A single  
read or write access for the 4Gb DDR2 SDRAM effectively consists  
of a single 4n-bit-wide, one-clock-cycle data transfer at the internal  
DRAM core and four corresponding n-bit-wide, one-half-clock-cycle  
data transfers at the I/O balls.  
Complete functionality is described throughout the document and  
any page or diagram may have been simplied to convey a topic  
and may not be inclusive of all requirements.  
Any specific requirement takes precedence over a general  
statement.  
A bidirectional data strobe (DQS, DQS#) is transmitted externally,  
along with data, for use in data capture at the receiver. DQS is a  
strobe transmitted by the DDR2 SDRAM during READs and by  
the memory controller during WRITEs. DQS is edge-aligned with  
data for READs and center-aligned with data for WRITEs. There  
are strobes, one for the lower byte (LDQS, LDQS#) and one for  
the upper byte (UDQS, UDQS#).  
INITIALIZATION  
DDR2 SDRAMs must be powered up and initialized in a predened  
manner. Operational procedures other than those specied may  
result in undened operation. The following sequence is required  
for power up and initialization and is shown in Figure 4 on page 6.  
The 2Gb DDR2 SDRAM operates from a differential clock (CK and  
CK#); the crossing of CK going HIGH and CK# going LOW will  
be referred to as the positive edge of CK. Commands (address  
and control signals) are registered at every positive edge of CK.  
Input data is registered on both edges of DQS, and output data is  
referenced to both edges of DQS, as well as to both edges of CK.  
Read and write accesses to the DDR2 SDRAM are burst oriented;  
accesses start at a selected location and continue for a programmed  
number of locations in a programmed sequence. Accesses begin  
with the registration of anACTIVE command, which is then followed  
by a READ or WRITE command. The address bits registered  
coincident with the ACTIVE command are used to select the bank  
and row to be accessed. The address bits registered coincident  
with the READ or WRITE command are used to select the bank  
and the starting column location for the burst access.  
The DDR2 SDRAM provides for programmable read or write  
burst lengths of four or eight locations. DDR2 SDRAM supports  
interrupting a burst read of eight with another read, or a burst  
write of eight with another write. An auto precharge function may  
be enabled to provide a self-timed row precharge that is initiated  
at the end of the burst access.  
As with standard DDR SDRAMs, the pipelined, multibank  
architecture of DDR2 SDRAMs allows for concurrent operation,  
thereby providing high, effective bandwidth by hiding row precharge  
and activation time.  
Aself refresh mode is provided, along with a power-saving power-  
down mode.  
All inputs are compatible with the JEDEC standard for SSTL_18.  
All full drive-strength outputs are SSTL_18-compatible.  
5
4154.03E-0716-ss-W3H32M72E-XBX-XBXF.  
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com