W3H264M16E-XB2X
*PRELIMINARY
256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA
FEATURES
Data rate = 400, 533 and 667 Mb/s
Package:
• 79 Plastic Ball Grid Array (PBGA), 11 x 14mm
• 1.27mm pitch
• Moisture Sensitivity Level (MSL): 3
Supply Voltage = 1.8V
Differential data strobe (DQS, DQS#) per byte
Internal, pipelined, double data rate architecture
4-bit prefetch architecture
DLL for alignment of DQ and DQS transitions with clock
signal
Eight internal banks for concurrent operation
Programmable Burst lengths: 4 or 8
Auto Refresh and Self Refresh Modes
On Die Termination (ODT)
Adjustable data – output drive strength
Programmable CAS latency: 3, 4, 5, 6, or 7
Posted CAS additive latency: 0, 1, 2, 3, 4, 5, or 6
Write latency = Read latency – 1* t
CK
Commercial, Industrial and Military Temperature Ranges
Organized as 2 ranks of 64M x 16
Weight: W3H264M16E-XB2X – TBD
* This product is under development, is not qualified or characterized and is subject to change
without notice.
BENEFITS
Larger ball pitch for higher reliability
Footprint compatible with W3H64M16E
TYPICAL APPLICATION
RAM
Host
FPGA/
Processor
DDR2/DDR3
W3H264M16E-XBI
SSD (SLC)
MSM32/MSM64 (SATA BGA)
W7N16GVHxxBI (PATA BGA)
n)
M512/M256/M128 (SATA, 2.5in)
Microsemi Corporation reserves the right to change products or specifications without notice.
March 2016
Rev. 1
© 2016 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
