W3E32M64S-XBX
White Electronic Designs
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
Bottom View
25.1 (0.988) MAX
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
T
R
P
N
M
L
K
J
H
G
25.1 (0.988)
MAX
19.05 (0.750)
NOM
F
E
D
C
B
A
1.27 (0.050)
NOM
0.61
(0.024)
NOM
0.762 (0.030) NOM
219 x
∅
2.03 (0.080)
MAX
19.05 (0.750) NOM
Note: This package utlizes solderballs which contain lead: Sn63Pb37
If you require lead free solder ball packages, please contack WEDC for information
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
W 3E 32M 64 S - XXX B X
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 64
2.5V Power Supply
DATA RATE (Mbs):
200 = 100MHz/200Mbs
250 = 125MHz/250Mbs
266 = 133MHz/266Mbs
333 = 166MHz/333Mbs
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA), 25mm x 25mm
DEVICE GRADE:
M = Military
= Industrial
-55°C to +125°C
-40°C to +85°C
I
C = Commercial 0°C to +70°C
February 2007
Rev. 4
16
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
