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W3E32M64S-333SBC 参数 Datasheet PDF下载

W3E32M64S-333SBC图片预览
型号: W3E32M64S-333SBC
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX64, 0.7ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 18 页 / 648 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3E32M64S-XSBX  
White Electronic Designs  
TRUTH TABLE – COMMANDS (NOTE 1)  
NAME (FUNCTION)  
CS#  
H
L
RAS#  
CAS#  
WE#  
X
ADDR  
X
DESELECT (NOP) (9)  
X
H
L
X
H
H
L
NO OPERATION (NOP) (9)  
H
X
ACTIVE (Select bank and activate row) ( 3)  
READ (Select bank and column, and start READ burst) (4)  
WRITE (Select bank and column, and start WRITE burst) (4)  
BURST TERMINATE (8)  
L
H
Bank/Row  
Bank/Col  
Bank/Col  
X
L
H
H
H
L
H
L
L
L
L
H
H
L
L
PRECHARGE (Deactivate row in bank or banks) ( 5)  
AUTO REFRESH or SELF REFRESH (Enter self refresh mode) (6, 7)  
LOAD MODE REGISTER (2)  
L
L
Code  
X
L
L
H
L
L
L
L
Op-Code  
TRUTH TABLE – DM OPERATION  
NAME (FUNCTION)  
DM  
L
DQs  
WRITE ENABLE (10)  
WRITE INHIBIT (10)  
Valid  
X
H
NOTES:  
1. CKE is HIGH for all commands shown except SELF REFRESH.  
2. A0-12 dene the op-code to be written to the selected Mode Register. BA0, BA1  
select either the mode register (0, 0) or the extended mode register (1, 0).  
3. A0-12 provide row address, and BA0, BA1 provide bank address.  
4. A0-9 provide column address; A10 HIGH enables the auto precharge feature (non  
persistent), while A10 LOW disables the auto precharge feature; BA0, BA1 provide  
bank address.  
6. This command is AUTO REFRESH if CKE is HIGH; SELF REFRESH if CKE is  
LOW.  
7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t  
Care” except for CKE.  
8. Applies only to read bursts with auto precharge disabled; this command is  
undened (and should not be used) for READ bursts with auto precharge enabled  
and for WRITE bursts.  
5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks  
precharged and BA0, BA1 are “Don’t Care.”  
9. DESELECT and NOP are functionally interchangeable.  
10. Used to mask write data; provided coincident with the corresponding data.  
Although not a JEDEC requirement, to provide for future  
functionality features, CKE must be active (High) during  
theAUTO REFRESH period. TheAUTO REFRESH period  
begins when theAUTO REFRESH command is registered  
and ends tRFC later.  
The procedure for exiting self refresh requires a sequence  
of commands. First, CK and CK# must be stable prior  
to CKE going back HIGH. Once CKE is HIGH, the DDR  
SDRAM must have NOP commands issued for tXSNR  
,
because time is required for the completion of any internal  
refresh in progress.  
SELF REFRESH*  
A simple algorithm for meeting both refresh and DLL  
requirements is to apply NOPs for tXSNR time, then a DLL  
Reset and NOPs for 200 additional clock cycles before  
applying any other command.  
The SELF REFRESH command can be used to retain  
data in the DDR SDRAM, even if the rest of the system  
is powered down. When in the self refresh mode, the  
DDR SDRAM retains data without external clocking. The  
SELF REFRESH command is initiated like an AUTO  
REFRESH command except CKE is disabled (LOW).  
The DLL is automatically disabled upon entering SELF  
REFRESH and is automatically enabled upon exiting SELF  
REFRESH (200 clock cycles must then occur before a  
READ command can be issued). Input signals except CKE  
are “Don’t Care” during SELF REFRESH. VREF voltage is  
also required for the full duration of SELF REFRESH.  
* Self refresh available in commercial and industrial temperatures only.  
January 2008  
Rev. 6  
9
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com