EDI88512CA
ORDERING INFORMATION
EDI 8 8 512 CA X X X
MICROSEMI CORPORATION:
SRAM:
ORGANIZATION, 512Kx8:
TECHNOLOGY:
CA = CMOS Standard Power
LPA = Low Power
ACCESS TIME (ns):
PACKAGE TYPE:
C
K
N
T
= 32 lead Sidebrazed DIP, 600 mil (Package 9)
= 36 lead Ceramic LCC (Package 502)
= 32 lead Ceramic SOJ (Package 140)
= 32 lead Sidebrazed DIP, 400 mil (Package 326)
B32 = 32 pin Ceramic Thinpack™ Flatpack (Package 321)
F32 = 32 pin Ceramic Flatpack (Package 344)
F36 = 36 pin Ceramic Flatpack (Package 316)
N36 = 36 lead Ceramic SOJ (Package 327)
DEVICE GRADE:
B = Military Grade*
M = Military Screened -55°C ≤ TA ≤ +125°C
I = Industrial
-40°C ≤ TA ≤ +85°C
0°C ≤ TA ≤ +70°C
C = Commercial
*This product is processed the same as the 5962-XXXXXMXX product but all test and mechanical requirements are per the Microsemi data sheet.
Microsemi Corporation reserves the right to change products or specifications without notice.
May 2014 © 2014 Microsemi Corporation. All rights reserved.
Rev. 15
9
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp