Differential LVDS Crystal Clock Oscillators
3HDF5761 and 3HDF5762 Series +3.3V, “F” family
MERCURY
Since 1973
3HDF5761 Package Dimensions and Recommended Pad Layout:
unit: mm [inches]
2.54[0.100]
[0.275± 0.006]
0.6[0.024]
[0.055]
1.4
7.00± 0.15
6
5
4
3HDF5761
4
3
5
2
6
1
M E C
2
3
1
5.08 [0.200]
typical
bottom view
1.5[0.059]
Pad 1
LVDS Output
LVDS Output
Pad 4
Pad 5
Tri-state
Top view
Pad 2 No Connection
Pad 3 Ground
Pad 6 Supply Voltage
Rounded pad is pad No. 1
5.08 [0.200]
3HDF5761 Recommended Solder Reflow Profile
Topside temperature of board to be 260°C min. and 270°C max.
Peak Temperature: 260°C max. and 10 sec. max.
Time within 5°C of actual peak: 20 to 40 sec. max.
260
250
240
Liquidus Temperature
200
20~40 sec.
Flux Activation
Temperature
150
Soaking temp: 140°C~225°C
Soaking time: 60~120 sec.
100
50
Reflow
Zone
30~60 sec.
Soaking Zone
Pre-heat 2
Pre-heat 1
Cooling
Time
(sec)
30
60 90 120 150 180 210 240 270 300 330
MERCURY
Page 4 of 4
Date: April 1, 2008
Rev. 1
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
