Differential LVPECL Crystal Clock Oscillators
HPK5761 Series 200 fsec Jitter +2.5V +3.3V “K” Family
MERCURY
Since 1973
HPK5761 Recommended Solder Reflow Profile (from IPC/JEDEC J-STD-020D.1)
Profile Feature
Preheat/Soak
Sn-Pb Eutectic Assembly
Pb-free Assembly
-
-
-
Temperature min. (Ts min.)
Temperature max. (Ts max.)
Time (ts) (Ts min. to Ts max.)
100⁰C
150⁰C
60 to 120 seconds
3⁰C / sec. max.
183⁰C
150⁰C
200⁰C
60 to 180 seconds
3⁰C / sec. max.
217⁰C
Ramp-up rate (TL to Tp)
Liquidous temperature (TL )
Time (tL) maintained above TL
60 to 150 seconds
60 to 150 seconds
Peak package body temperature (Tp)
Time (Tp) within 5⁰C of the classification temperature Tc
Ramp-down rate (Tp to TL)
235⁰C
260⁰C
10 to 30 seconds
6⁰C / second max.
6 minutes max.
20 to 40 seconds
6⁰C / second max.
8 minutes max.
Time 25⁰C to peak temperature
All temperatures refer to topside of the package, measured on the package body surface.
MERCURY
Page 4 of 4
Date: Nov. 1, 2012
Rev. 1
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
