MX25L1635D
(17) Release from Deep Power-down (RDP), Read Electronic Signature (RES) .................................................22
(18) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) .............................................22
Table 7.ID Definitions.......................................................................................................................................23
(19) Enter Secured OTP (ENSO)......................................................................................................................23
(20) Exit Secured OTP (EXSO) ........................................................................................................................23
(21) Read Security Register (RDSCUR) ...........................................................................................................23
(22) Write Security Register (WRSCUR) ...........................................................................................................24
Table 8.Security Register Definition .................................................................................................................24
POWER-ON STATE ...................................................................................................................................................25
ELECTRICAL SPECIFICATIONS ..............................................................................................................................26
Figure 2.Maximum Negative Overshoot Waveform............................................................................................26
ABSOLUTE MAXIMUM RATINGS ...................................................................................................................26
CAPACITANCE TA = 25° C, f = 1.0 MHz ...........................................................................................................26
Figure 3. Maximum Positive Overshoot Waveform ............................................................................................26
Figure 5. OUTPUT LOADING..........................................................................................................................27
Figure 4.INPUTTEST WAVEFORMS AND MEASUREMENT LEVEL .............................................................27
Table 9.DC CHARACTERISTICS (Temperature = -40° C to 85°C for Industrial grade,VCC = 2.7V ~ 3.6V)........28
Table 10.AC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V) ....29
Figure 6. Serial Input Timing.............................................................................................................................30
Figure 7.OutputTiming ....................................................................................................................................30
Timing Analysis .......................................................................................................................................................30
Figure 8.WP# SetupTiming and HoldTiming during WRSR when SRWD=1 .....................................................31
Figure 9.Write Enable (WREN) Sequence (Command 06) ................................................................................31
Figure 10.Write Disable (WRDI) Sequence (Command 04) ...............................................................................31
Figure 11.Read Identification (RDID) Sequence (Command 9F) .......................................................................32
Figure 12.Read Status Register (RDSR) Sequence (Command 05) .................................................................32
Figure 13.Write Status Register (WRSR) Sequence (Command 01) ................................................................32
Figure 14.Read Data Bytes (READ) Sequence (Command 03) .......................................................................33
Figure 15.Read at Higher Speed (FAST_READ) Sequence (Command 0B) ....................................................33
Figure 16.2 x I/O Read Mode Sequence (Command BB) .................................................................................34
Figure 17.4 x I/O Read Mode Sequence (Command EB) .................................................................................34
Figure 18.4 x I/O Read enhance performance Mode Sequence (Command EB) ...............................................35
Figure 19.Page Program (PP) Sequence (Command 02).................................................................................36
Figure 20.4 x I/O Page Program (4PP) Sequence (Command 38) ...................................................................36
Figure 21.Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) .......................37
Figure 22. Sector Erase (SE) Sequence (Command 20) ..................................................................................37
Figure 23.Block Erase (BE) Sequence (Command D8) ...................................................................................37
Figure 24.Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................38
Figure 25.Deep Power-down (DP) Sequence (Command B9) ..........................................................................38
P/N:PM1374
REV. 1.5, OCT. 01, 2008
3
Macronix [ MACRONIX INTERNATIONAL ]
