MX25L1635D
Table 10. AC CHARACTERISTICS (Temperature = -40° C to 85° C for Industrial grade, VCC = 2.7V ~ 3.6V)
Symbol
Alt.
Parameter
Min.
Typ. Max.
Unit
fSCLK
fC
Clock Frequency for the following instructions:
FAST_READ, PP, SE, BE, CE, DP, RES,RDP
WREN, WRDI, RDID, RDSR, WRSR
D.C.
86 & 104 MHz
(Condition:15pF)
D.C.
66
MHz
(Condition:30pF)
fRSCLK
fTSCLK
fR
fT
Clock Frequency for READ instructions
Clock Frequency for 2READ instructions
Clock Frequency for 4READ instructions
33
75
75
MHz
MHz
MHz
fQ
(Condition:15pF)
ns
tCH(1)
tCLH Clock High Time
tCLL Clock Low Time
4.8
4.8
0.1
0.1
5
tCL(1)
ns
V/ns
V/ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
us
us
ms
us
ms
ms
s
tCLCH(2)
tCHCL(2)
tSLCH
tCHSL
tDVCH
tCHDX
tCHSH
tSHCH
Clock Rise Time (3) (peak to peak)
Clock Fall Time (3) (peak to peak)
tCSS CS# Active Setup Time (relative to SCLK)
CS# Not Active Hold Time (relative to SCLK)
tDSU Data In Setup Time
5
2
tDH
Data In Hold Time
5
CS# Active Hold Time (relative to SCLK)
CS# Not Active Setup Time (relative to SCLK)
5
5
tSHSL(3) tCSH CS# Deselect Time
Read
15
50
Write/Erase/Program
2.7V-3.6V
tSHQZ(2) tDIS Output Disable Time
10
8
3.0V-3.6V
tCLQV
tV
Clock Low to Output Valid
Loading:30pF/15pF
2.7V-3.6V
10/8
8/6
3.0V-3.6V
tCLQX
tWHSL(4)
tSHWL(4)
tDP(2)
tRES1(2)
tRES2(2)
tW
tHO
Output Hold Time
0
Write Protect Setup Time
Write Protect Hold Time
CS#HightoDeepPower-downMode
20
100
10
8.8
8.8
100
300
5
CS# High to Standby Mode without Electronic Signature Read
CS# High to Standby Mode with Electronic Signature Read
Write Status Register Cycle Time
Byte-Program
40
9
tBP
tPP
Page Program Cycle Time
1.4
60
0.7
14
tSE
Sector Erase Cycle Time
300
2
tBE
Block Erase Cycle Time
tCE
Chip Erase Cycle Time
30
s
Notes:
1. tCH + tCL must be greater than or equal to 1/ fC
2. Value guaranteed by characterization, not 100% tested in production.
3. tSHSL=15ns from read instruction, tSHSL=50ns from Write/Erase/Program instruction.
4. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
5. Test condition is shown as Figure 4, 5.
P/N:PM1374
REV. 1.5, OCT. 01, 2008
29