79C0832
8 Megabit (256K x 32-Bit)
EEPROM MCM
FEATURES:
DESCRIPTION:
• 256k x 32-bit EEPROM MCM
• RAD-PAK® radiation-hardened against natural
• space radiation
Maxwell Technologies’ 79C0832 multi-chip module (MCM)
memory features a greater than 100 krad (Si) total dose toler-
ance, dependent upon orbit. Using Maxwell Technologies’ pat-
ented radiation-hardened RAD-PAK® MCM packaging
technology, the 79C0832 is the first radiation-hardened 8
megabit MCM EEPROM for space application. The 79C0832
uses eight 1 Megabit high speed CMOS die to yield an 8
megabit product. The 79C0832 is capable of in-system electri-
cal byte and page programmability. It has a 128 x 8 byte page
programming function to make its erase and write operations
faster. It also features Data Polling and a Ready/Busy signal to
indicate the completion of erase and programming operations.
In the 79C0832, hardware data protection is provided with the
RES pin, in addition to noise protection on the WE signal and
write inhibit on power on and off. Software data protection is
implemented using the JEDEC optional standard algorithm.
• Total dose hardness:
- >100 krad (Si)
- Dependent upon orbit
• Excellent Single event effects
- SEL > 120 MeV/mg/cm2
TH
- SEU > 90 MeV/mg/cm2 read mode
- SEU = 18 MeV/mg/cm2 write mode
• High endurance
- 10,000 cycles/byte (Page Programming Mode)
- 10 year data retention
• Page Write Mode: 1 to 8 X 128 byte page
• High Speed:
- 150 and 200 ns maximum access times
• Automatic programming
- 10 ms automatic Page/Byte write
• Low power dissipation
Maxwell Technologies' patented RAD-PAK® packaging technol-
ogy incorporates radiation shielding in the microcircuit pack-
age. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, RAD-PAK provides greater than 100
krad (Si) radiation dose tolerance. This product is available
with screening up to Maxwell Technologies self-defined Class
K.
- 160 mW/MHz active current
- 880 µW standby current
02.14.06 REV 15
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All data sheets are subject to change without notice
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