SCOPE:
MICROPROCESSOR SUPERVISORY CIRCUITS
Generic Number
MAX705(x)/883B
MAX706(x)/883B
MAX707(x)/883B
MAX708(x)/883B
MAX813L(x)/883B
Device Type
01
02
03
04
05
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Case Outline
Package Code
Outline Letter
Mil-Std-1835
MAXIM SMD
JA
P
GDIP1-T08 or CDIP2-T08
8 LEAD CERDIP
J08
LP
2
CQCC1-N20
20 Pin Leadless Chip
L20
Absolute Maximum Ratings
Terminal Voltage (with respect to GND)
V
CC
.................................................................................................................. -0.3V to +6.0V
All other Inputs 1/ .................................................................................. -0.3V to (Vcc+0.3V)
Input Current
V
CC
................................................................................................................................. 10mA
GND ............................................................................................................................... 10mA
Output Current (all outputs) ............................................................................................... 10mA
Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C
Storage Temperature ......................................................................................... -65°C to +160°C
Continuous Power Dissipation ................................................................................... T
A
=+70°C
8 lead CERDIP(derate 8.0mW/°C above +70°C) ...................................................... 640mW
20 lead LCC(derate 9.1mW/°C above +70°C) .......................................................... 727mW
Junction Temperature T
J
............................................................................................. +150°C
Thermal Resistance, Junction to Case,
ΘJC:
Case Outline 8 lead CERDIP........................................................................ 55°C/W
Case Outline 20 leadless Chip carrier .......................................................... 20°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
Case Outline 8 lead CERDIP...................................................................... 125°C/W
Case Outline 20 leadless Chip carrier ........................................................ 110°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ............................................................... -55°C to
+125°C
Supply Voltage Range (V
CC
) ...................................................................... +1.2V to +5.5V
___
NOTE 1: The input voltage limits on PFI and MR may be exceeded if the input current is less than 10mA.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MAX705/706/707/708/813L/883B
for /883B and SMD 5962-93267
19-0216
Page 2 of
Rev. C
7
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
