2
Extremely Accurate I C-Integrated
RTC/TCXO/Crystal
signal line. All N.C. (no connect) pins must be connect-
Handling, PC Board Layout,
and Assembly
The DS3231 package contains a quartz tuning-fork
crystal. Pick-and-place equipment can be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
ed to ground.
Moisture-sensitive packages are shipped from the fac-
tory dry packed. Handling instructions listed on the
package label must be followed to prevent damage
during reflow. Refer to the IPC/JEDEC J-STD-020 stan-
dard for moisture-sensitive device (MSD) classifications
and reflow profiles. Exposure to reflow is limited to 2
times maximum.
DS231
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
Pin Configuration
Chip Information
TRANSISTOR COUNT: 33,000
TOP VIEW
SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
32kHz
1
2
3
4
5
6
7
8
16 SCL
15 SDA
V
CC
Thermal Information
Theta-JA: +73°C/W
INT/SQW
RST
14 V
BAT
13 GND
12 N.C.
11 N.C.
10 N.C.
Theta-JC: +23°C/W
DS3231
N.C.
Package Information
N.C.
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
N.C.
N.C.
9
N.C.
SO
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
16 SO
W16#H2
21-0042
18
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