RTCs with Constant-Voltage Trickle Charger
5C/DS12R87
5. Maximum time above 220°C is less than 30 seconds.
Handling, PC Board Layout,
6. Peak temperature is less than or equal to 230°C.
and Assembly
Exposure to reflow is limited to two times maximum.
The EDIP and BGA packages contain a quartz tuning-
fork crystal. Pick-and-place equipment can be used,
but precautions should be taken to ensure that exces-
sive shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
Moisture-sensitive packages are shipped from the
factory dry-packed. Handling instructions listed on the
package label must be followed to prevent damage dur-
ing reflow. Refer to the IPC/JEDEC J-STD-020B standard
for Moisture-Sensitive Device (MSD) classifications.
The BGA package can be reflowed as long as the fol-
lowing conditions are met:
The EDIP (DS12CR887) module can be successfully
processed through conventional wave-soldering tech-
niques so long as temperature exposure to the lithium
energy source does not exceed +85°C. Post-solder
cleaning with water-washing techniques is acceptable,
provided that ultrasonic vibration is not used. Such
cleaning can damage the crystal.
1. Preheating (below 160°C) is within 90 seconds.
2. Maximum time above 150°C is less than 180 seconds.
3. Maximum time above 170°C is less than 100 seconds.
4. Maximum time above 200°C is less than 60 seconds.
Pin Configurations
TOP VIEW
MOT
X1
1
2
3
4
5
6
7
8
9
24 V
CC
MOT
N.C.
N.C.
AD0
AD1
AD2
AD3
AD4
AD5
1
2
3
4
5
6
7
8
9
24 V
CC
23 SQW
22 N.C.
21 RCLR
23 SQW
22 N.C.
21 N.C.
20 N.C.
19 IRQ
18 RESET
17 DS
X2
AD0
AD1
AD2
AD3
AD4
AD5
20
V
BACKUP
DS12R885
DS12CR887
19 IRQ
18 RESET
17 DS
16 GND
15 R/W
14 AS
16 N.C.
15 R/W
14 AS
AD6 10
AD7 11
GND 12
AD6 10
AD7 11
GND 12
13 CS
13 CS
SO (0.300")
EDIP (0.700")
____________________________________________________________________ 21
MAXIM [ MAXIM INTEGRATED PRODUCTS ]
