DA9275.007
19 February 2004
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Seating Plane Co-planarity
Lead Finish
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P
1
T
D
O
P
O
P
2
E
F
W
B
O
A
A
O
K
O
D
1
Section A-A
User Direction of Feed
Pin 1 Designator
Dimension
Min/Max
Unit
Ao
Bo
Do
D1
E
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
F
5.50 ±0.05
1.45 ±0.10
4.0
Ko
Po
P1
P2
T
8.0
2.0
0.3
±0.10
±0.05
±0.05
W
12.00 +0.30/-0.10
8 (10)
MAS [ MICRO ANALOG SYSTEMS ]
